Widest Operational Use Cases
- Minimized bonding temperature
- Functional at operational temperatures of 250°C and above
- Unlimited submerged bonding capability
- No applied force required for bonding and debonding
- Stronger bonds than leading competitors
SBC-LT Series Carrier
Zero-force temporary bonding and debonding for semiconductor and advanced packaging — delivered fully prepared, no capital equipment required.
Product Overview
Mobile Temporary Bonding & Debonding Carrier
The SBC-LT Series Carrier is Semi-Bond's mobile temporary bonding solution for semiconductor backgrinding, advanced packaging, and related processes. Carriers are delivered fully prepared for immediate use — no spin coat, bake, or cure of bonding material required.
Carrier size and shape is customizable to meet customer needs, available in standard wafer diameters as well as customer-defined geometries.
SBC-LT Bond and Release Procedure
How It Works
The SBC-LT process integrates into existing workflows in five steps, with zero-force bond and debond at every stage.
Step 1
Surface Preparation
Prepare the device surface for bonding
Step 2
Device Bond
Zero-force bond to the SBC-LT carrier
Step 3
Device Processing
e.g. backgrinding, wet/dry processes
Step 4
Processed Device
Device remains securely bonded throughout
Step 5
Device Release
Zero-force release — no thermal, laser, or cleaning step
Key Benefits
Benefits of the SBC-LT Series Carriers
Delivered Fully Prepared
- Carriers arrive ready for bonding and debonding — no preparation needed
- No spin coat, bake, or cure of bonding material
- Maximized reusability: tens of bond and debond cycles per carrier
Simplified Release
- Simplified bond and debond processes reduce production times and delays
- No thermal slide, laser step, or cleaning step required
Lowest Barrier to Entry
- No capital equipment depreciation — no coaters, bonders, or debonders needed
- Lowest upfront and total cost of ownership
- Ideal for low-volume production and R&D customers
Competitive Comparison
SBC-LT vs. Electrostatic & Adhesive Carriers
The SBC-LT Series Carrier outperforms competing temporary bonding technologies across every key metric.
| Feature | Semi-Bond Carrier | Electrostatic Carrier | Adhesive Carrier |
|---|---|---|---|
| No Applied Bonding and Debonding Force | ✓ | ✗ | ✗ |
| Functional When Submerged | ✓ | ✗ | ✗ |
| Residue Free | ✓ | ✓ | ✗ |
| Reusability | ✓ | ✓ | ✗ |
| No Capital Equipment Required | ✓ | ✗ | ✓ |
| Total Cost of Ownership | $ | $$ | $$$ |
Product Brochure
SBC-LT Series Carrier Brochure
