Lowest Total Cost of Ownership
No capital equipment depreciation — no coaters, bonders, or debonders. A fraction of the cost of electrostatic or adhesive carrier solutions.
Mobile Temporary Bonding & Debonding Carriers for Semiconductor Manufacturing
Zero-force release. No support equipment. Bond and debond in seconds. Designed and manufactured in the United States.
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Why Semi-Bond
A Better Approach to Temporary Wafer Bonding
Semi-Bond carriers are engineered to reduce cost, minimize process complexity, and protect your devices throughout the bonding and debonding cycle.
Delivered Fully Prepared
No spin coat, bake, or cure of bonding material. Carriers arrive ready to use and support tens of bond and debond cycles.
Fast and Easy Bond & Debond
No thermal slide, laser step, or cleaning step. Bond and debond in seconds with zero applied force.
250°C+ Operational Temperature
Functional at operational temperatures of 250°C and above, with unlimited submerged bonding capability.
Zero-Force Release
Zero-force bond and debond eliminates mechanical stress on devices — stronger bonds than leading competitors, residue-free release.
Multipurpose Process Compatibility
Integrates into wet and dry processes including backgrinding, advanced packaging, and more — compatible with almost any substrate.
About Semi-Bond
Proprietary Technology. Domestic Manufacturing.
Semi-Bond specializes in designing and manufacturing mobile temporary bonding and debonding carriers for the semiconductor and advanced packaging industries. Our proprietary technology enables zero-force release, wide operational envelopes, and ultra-strong bonds that can hold even the smallest devices.
- Customer-first: we strive to understand and meet each customer's specific requirements
- Custom solutions available in standard wafer diameters and customer-defined shapes and sizes
- All products designed and manufactured in the United States
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