Engineered for the semiconductor and advanced packaging industries. Zero-force release. No support equipment. Made in the USA.
Product Overview
Semi-Bond mobile temporary bonding and debonding carriers deliver a competitive total cost of ownership while integrating directly into your existing processes — no support equipment required.
Our flagship product, the SBC-LT Series Carrier, is delivered fully prepared for bonding and debonding — no spin coat, bake, or cure of bonding material required. Each carrier supports tens of bond and debond cycles and is functional at operational temperatures of 250°C and above.
Semi-Bond carriers offer a total cost of ownership that is a fraction of competing temporary bonding and debonding solutions. Lower consumable costs, faster cycle times, and no specialized equipment combine to deliver meaningful savings.
Our carriers integrate directly into your existing semiconductor fabrication and advanced packaging processes. There is no need to procure or qualify additional handling equipment or processing tools.
Bonding and debonding is accomplished in seconds, dramatically reducing process cycle times compared to conventional temporary bonding methods that require lengthy thermal or chemical steps.
Semi-Bond carriers integrate seamlessly into both wet and dry semiconductor processes, making them a versatile solution across a broad range of back-end-of-line and advanced packaging workflows.
Zero-force bond and debond steps eliminate mechanical stress on devices and substrates, minimizing the risk of device damage, breakage, and mishandling — protecting your yield throughout the process.
Our carriers maintain reliable bond integrity across a wide range of temperatures, pressures, and chemical environments, ensuring consistent performance without bond degradation during demanding process steps.
Semi-Bond carriers can bond to almost any substrate, offering flexibility for diverse semiconductor and advanced packaging applications regardless of substrate material or surface chemistry.
All Semi-Bond products are designed and manufactured in the USA, ensuring quality control, supply chain reliability, and domestic sourcing for customers who require it.
In Action
Custom Solutions
Semi-Bond carriers are offered in standard wafer diameters as well as customer-defined shapes and sizes to accommodate a wide range of device and packaging geometries.